EP1S60F1020C6N vs EP1S60F1020C5 Vergleich
Detaillierter Direktvergleich von EP1S60F1020C6N von Intel und EP1S60F1020C5 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP1S60F1020C5 - 57K-Cell Stratix FPGA, 1020-BGA | Altera/Intel
EP1S60F1020C5 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP1S60F1020C6N | EP1S60F1020C5 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,00 | $171,00 |
| Series | Stratix | Stratix |
| Family | Stratix (EP1S) | Stratix (EP1S) |
| Logic Elements (LEs) | 57,120 | — |
| Logic Cells | 6,570 blocks (per chipdig datasheet summary) | — |
| Embedded RAM (Total Bits) | 5,215,104 bits | — |
| Embedded Multipliers | 773 (18x18) | — |
| Maximum User I/O Pins | Per datasheet, package-dependent (F1020 variant) | — |
| Package Type | 1020-ball FBGA (FineLine BGA), 33 x 33 mm, 1 mm pitch | FBGA-1020 (FineLine BGA) |
| Logic Family / Process | CMOS, 0.13 µm | — |
| Betriebstemperatur | 0°C to +85°C (Commercial) | 0 C to 85 C (Commercial) |
| Versorgungsspannung | Per datasheet (Stratix Device Handbook Vol. 1) | — |
| Speed Grade | C6 (mid-tier) | C5 |
| Lead-Free / Pb-Free | Yes (suffix 'N') | — |
| RoHS-Status | Compliant (per 'N' suffix) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Configuration | JTAG / Passive Serial / Fast Passive Parallel via MSEL pins | — |
| PLL Count | 12 (per Stratix family datasheet) | — |
| Memory Block Types | TriMatrix (M512, M4K, M-RAM) | — |
| Logic Elements | — | 57,120 |
| Configurable Logic Blocks (CLBs) | — | 6,570 |
| Total RAM Bits | — | 5,215,104 (5.2 Mbit) |
| User I/O Pins | — | 773 |
| Number of PLLs | — | 12 |
| Core Voltage | — | 1.5 V |
| I/O Voltage Tolerance | — | 3.3 V (multi-standard) |
| Package Dimensions | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 0.13 µm CMOS, 1.5 V core |