EP1S60F1020C6N vs EP1S60F1020C5 Comparación
Comparación detallada lado a lado de EP1S60F1020C6N por Intel y EP1S60F1020C5 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1S60F1020C6N | EP1S60F1020C5 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $195,00 | $171,00 |
| Series | Stratix | Stratix |
| Family | Stratix (EP1S) | Stratix (EP1S) |
| Logic Elements (LEs) | 57,120 | — |
| Logic Cells | 6,570 blocks (per chipdig datasheet summary) | — |
| Embedded RAM (Total Bits) | 5,215,104 bits | — |
| Embedded Multipliers | 773 (18x18) | — |
| Maximum User I/O Pins | Per datasheet, package-dependent (F1020 variant) | — |
| Package Type | 1020-ball FBGA (FineLine BGA), 33 x 33 mm, 1 mm pitch | FBGA-1020 (FineLine BGA) |
| Logic Family / Process | CMOS, 0.13 µm | — |
| Temperatura de funcionamiento | 0°C to +85°C (Commercial) | 0 C to 85 C (Commercial) |
| Tensión de alimentación | Per datasheet (Stratix Device Handbook Vol. 1) | — |
| Speed Grade | C6 (mid-tier) | C5 |
| Lead-Free / Pb-Free | Yes (suffix 'N') | — |
| Estado RoHS | Compliant (per 'N' suffix) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Configuration | JTAG / Passive Serial / Fast Passive Parallel via MSEL pins | — |
| PLL Count | 12 (per Stratix family datasheet) | — |
| Memory Block Types | TriMatrix (M512, M4K, M-RAM) | — |
| Logic Elements | — | 57,120 |
| Configurable Logic Blocks (CLBs) | — | 6,570 |
| Total RAM Bits | — | 5,215,104 (5.2 Mbit) |
| User I/O Pins | — | 773 |
| Number of PLLs | — | 12 |
| Core Voltage | — | 1.5 V |
| I/O Voltage Tolerance | — | 3.3 V (multi-standard) |
| Package Dimensions | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 0.13 µm CMOS, 1.5 V core |