EP1S60F1020C6N vs EP1S60F1020C5 Comparaison
Comparaison détaillée côte à côte de EP1S60F1020C6N par Intel et EP1S60F1020C5 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1S60F1020C6N | EP1S60F1020C5 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $195,00 | $171,00 |
| Series | Stratix | Stratix |
| Family | Stratix (EP1S) | Stratix (EP1S) |
| Logic Elements (LEs) | 57,120 | — |
| Logic Cells | 6,570 blocks (per chipdig datasheet summary) | — |
| Embedded RAM (Total Bits) | 5,215,104 bits | — |
| Embedded Multipliers | 773 (18x18) | — |
| Maximum User I/O Pins | Per datasheet, package-dependent (F1020 variant) | — |
| Package Type | 1020-ball FBGA (FineLine BGA), 33 x 33 mm, 1 mm pitch | FBGA-1020 (FineLine BGA) |
| Logic Family / Process | CMOS, 0.13 µm | — |
| Température de fonctionnement | 0°C to +85°C (Commercial) | 0 C to 85 C (Commercial) |
| Tension d'alimentation | Per datasheet (Stratix Device Handbook Vol. 1) | — |
| Speed Grade | C6 (mid-tier) | C5 |
| Lead-Free / Pb-Free | Yes (suffix 'N') | — |
| Statut RoHS | Compliant (per 'N' suffix) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| Configuration | JTAG / Passive Serial / Fast Passive Parallel via MSEL pins | — |
| PLL Count | 12 (per Stratix family datasheet) | — |
| Memory Block Types | TriMatrix (M512, M4K, M-RAM) | — |
| Logic Elements | — | 57,120 |
| Configurable Logic Blocks (CLBs) | — | 6,570 |
| Total RAM Bits | — | 5,215,104 (5.2 Mbit) |
| User I/O Pins | — | 773 |
| Number of PLLs | — | 12 |
| Core Voltage | — | 1.5 V |
| I/O Voltage Tolerance | — | 3.3 V (multi-standard) |
| Package Dimensions | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 0.13 µm CMOS, 1.5 V core |