EP1SGX25DF672I5N vs EP1SGX25DF672C6N Vergleich
Detaillierter Direktvergleich von EP1SGX25DF672I5N von Intel und EP1SGX25DF672C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES
EP1SGX25DF672I5N ⚠ Letzte BestellmöglichkeitIntel
EP1SGX25DF672C6N - Stratix GX FPGA, 25K LE, 672-FBGA | Intel (Altera)
EP1SGX25DF672C6N ObsoleteSpezifikationsvergleich
| Parameter | EP1SGX25DF672I5N | EP1SGX25DF672C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $118,00 | $210,00 |
| Family | Stratix GX | Stratix GX (Stratix I GX) |
| Logic Elements | 25,660 | — |
| Logic Cells (CLBs) | 2,566 | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V |
| High-Speed Transceiver Channels | 4 to 20 (CDR/SERDES) | — |
| Max Transceiver Data Rate | 3.1875 Gbps | — |
| Gehäuse | 672-ball FC-FBGA | FBGA-672 (FC-FBGA), 33 x 33 mm, 1.0 mm pitch |
| Package Body Size | 33 x 33 mm | — |
| Ball Pitch | 1.0 mm | — |
| Betriebstemperatur | -40C to +85C (Industrial) | 0C to 85C (commercial) |
| Montageart | Surface Mount | Surface Mount |
| Lead-Free | Yes | — |
| RoHS-Status | Compliant | Lead Free (per part suffix 'N' designator) |
| Logic Family | CMOS (SRAM-based FPGA) | CMOS |
| Total I/O Pins | [DATA_NEEDED: total user I/O pin count] | — |
| Embedded Memory | [DATA_NEEDED: TriMatrix memory block count] | — |
| Series | — | Stratix GX |
| Logic Elements / Cells | — | 25,660 |
| Logic Array Blocks (LABs) | — | 2,566 |
| User I/O Count | — | 455 |
| MSL-Level | — | 3 (168 hours) |
| HTSUS Code | — | 8542.39.0001 |
| Pin-Anzahl | — | 672 |