EP1SGX25DF672I5N vs EP1SGX25DF672C6N Comparaison
Comparaison détaillée côte à côte de EP1SGX25DF672I5N par Intel et EP1SGX25DF672C6N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES
EP1SGX25DF672I5N ⚠ Dernier achatIntel
EP1SGX25DF672C6N - Stratix GX FPGA, 25K LE, 672-FBGA | Intel (Altera)
EP1SGX25DF672C6N ObsoleteComparaison des spécifications
| Paramètre | EP1SGX25DF672I5N | EP1SGX25DF672C6N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $118,00 | $210,00 |
| Family | Stratix GX | Stratix GX (Stratix I GX) |
| Logic Elements | 25,660 | — |
| Logic Cells (CLBs) | 2,566 | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V |
| High-Speed Transceiver Channels | 4 to 20 (CDR/SERDES) | — |
| Max Transceiver Data Rate | 3.1875 Gbps | — |
| Boîtier | 672-ball FC-FBGA | FBGA-672 (FC-FBGA), 33 x 33 mm, 1.0 mm pitch |
| Package Body Size | 33 x 33 mm | — |
| Ball Pitch | 1.0 mm | — |
| Température de fonctionnement | -40C to +85C (Industrial) | 0C to 85C (commercial) |
| Type de montage | Surface Mount | Surface Mount |
| Lead-Free | Yes | — |
| Statut RoHS | Compliant | Lead Free (per part suffix 'N' designator) |
| Logic Family | CMOS (SRAM-based FPGA) | CMOS |
| Total I/O Pins | [DATA_NEEDED: total user I/O pin count] | — |
| Embedded Memory | [DATA_NEEDED: TriMatrix memory block count] | — |
| Series | — | Stratix GX |
| Logic Elements / Cells | — | 25,660 |
| Logic Array Blocks (LABs) | — | 2,566 |
| User I/O Count | — | 455 |
| Niveau MSL | — | 3 (168 hours) |
| HTSUS Code | — | 8542.39.0001 |
| Nombre de broches | — | 672 |