EP1SGX25DF672I5N vs EP1SGX25DF672C6N Comparación
Comparación detallada lado a lado de EP1SGX25DF672I5N por Intel y EP1SGX25DF672C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES
EP1SGX25DF672I5N ⚠ Última compraIntel
EP1SGX25DF672C6N - Stratix GX FPGA, 25K LE, 672-FBGA | Intel (Altera)
EP1SGX25DF672C6N ObsoleteComparación de especificaciones
| Parámetro | EP1SGX25DF672I5N | EP1SGX25DF672C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $118,00 | $210,00 |
| Family | Stratix GX | Stratix GX (Stratix I GX) |
| Logic Elements | 25,660 | — |
| Logic Cells (CLBs) | 2,566 | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V |
| High-Speed Transceiver Channels | 4 to 20 (CDR/SERDES) | — |
| Max Transceiver Data Rate | 3.1875 Gbps | — |
| Encapsulado | 672-ball FC-FBGA | FBGA-672 (FC-FBGA), 33 x 33 mm, 1.0 mm pitch |
| Package Body Size | 33 x 33 mm | — |
| Ball Pitch | 1.0 mm | — |
| Temperatura de funcionamiento | -40C to +85C (Industrial) | 0C to 85C (commercial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead-Free | Yes | — |
| Estado RoHS | Compliant | Lead Free (per part suffix 'N' designator) |
| Logic Family | CMOS (SRAM-based FPGA) | CMOS |
| Total I/O Pins | [DATA_NEEDED: total user I/O pin count] | — |
| Embedded Memory | [DATA_NEEDED: TriMatrix memory block count] | — |
| Series | — | Stratix GX |
| Logic Elements / Cells | — | 25,660 |
| Logic Array Blocks (LABs) | — | 2,566 |
| User I/O Count | — | 455 |
| Nivel MSL | — | 3 (168 hours) |
| HTSUS Code | — | 8542.39.0001 |
| Recuento de pines | — | 672 |