EP1SGX25DF672I7 vs EP1SGX25DF672C7 Vergleich
Detaillierter Direktvergleich von EP1SGX25DF672I7 von Intel und EP1SGX25DF672C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1SGX25DF672I7 | EP1SGX25DF672C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.190,00 | $125,40 |
| Series | Stratix GX | Stratix GX |
| Family | Stratix GX (EP1SGX25) | Stratix GX |
| Logic Elements | 25,660 | — |
| Configurable Logic Blocks (CLBs) | 2,566 | — |
| Total RAM Bits | 1,944,576 | 1,944,576 |
| Number of Logic Array Blocks (LABs) | 455 | — |
| Maximum Internal Clock Frequency | 4385.97 MHz | — |
| Combinatorial CLB Delay (max) | 9.48 ns | — |
| Process Technology | CMOS 130 nm | 0.13 µm CMOS, SRAM-based |
| Nominal Supply Voltage | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Operating Temperature Grade | MILITARY / Industrial | — |
| Speed Grade | I7 (slowest industrial) | C7 (moderate Fmax bin) |
| Package Code | DF (672-ball FC-FBGA) | — |
| Number of Terminals | 672 | — |
| Terminal Form | Ball (BGA) | — |
| Package Shape | Square | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Logic Elements (LE) | — | 25,660 |
| Logic Array Blocks (LABs) | — | 2,566 |
| User I/O Count | — | 455 |
| Embedded DSP Blocks | — | 14 |
| Embedded Transceivers | — | Yes (GX family) |
| Core Supply Voltage | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Betriebstemperatur | — | 0 °C to +85 °C (Commercial) |
| Gehäuse | — | 672-FBGA (27 × 27 mm, 1.0 mm pitch) |
| Lead Free / RoHS | — | Lead-Free, RoHS Compliant |
| PLL Count | — | [DATA_NEEDED: PLL count] |