EP1SGX25DF672I7 vs EP1SGX25DF672C7 Comparaison
Comparaison détaillée côte à côte de EP1SGX25DF672I7 par Intel et EP1SGX25DF672C7 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1SGX25DF672I7 | EP1SGX25DF672C7 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 190,00 | $125,40 |
| Series | Stratix GX | Stratix GX |
| Family | Stratix GX (EP1SGX25) | Stratix GX |
| Logic Elements | 25,660 | — |
| Configurable Logic Blocks (CLBs) | 2,566 | — |
| Total RAM Bits | 1,944,576 | 1,944,576 |
| Number of Logic Array Blocks (LABs) | 455 | — |
| Maximum Internal Clock Frequency | 4385.97 MHz | — |
| Combinatorial CLB Delay (max) | 9.48 ns | — |
| Process Technology | CMOS 130 nm | 0.13 µm CMOS, SRAM-based |
| Nominal Supply Voltage | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Operating Temperature Grade | MILITARY / Industrial | — |
| Speed Grade | I7 (slowest industrial) | C7 (moderate Fmax bin) |
| Package Code | DF (672-ball FC-FBGA) | — |
| Number of Terminals | 672 | — |
| Terminal Form | Ball (BGA) | — |
| Package Shape | Square | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Elements (LE) | — | 25,660 |
| Logic Array Blocks (LABs) | — | 2,566 |
| User I/O Count | — | 455 |
| Embedded DSP Blocks | — | 14 |
| Embedded Transceivers | — | Yes (GX family) |
| Core Supply Voltage | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Température de fonctionnement | — | 0 °C to +85 °C (Commercial) |
| Boîtier | — | 672-FBGA (27 × 27 mm, 1.0 mm pitch) |
| Lead Free / RoHS | — | Lead-Free, RoHS Compliant |
| PLL Count | — | [DATA_NEEDED: PLL count] |