EP1SGX25DF672I7 vs EP1SGX25DF672C7 Comparación
Comparación detallada lado a lado de EP1SGX25DF672I7 por Intel y EP1SGX25DF672C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1SGX25DF672I7 | EP1SGX25DF672C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.190,00 | $125,40 |
| Series | Stratix GX | Stratix GX |
| Family | Stratix GX (EP1SGX25) | Stratix GX |
| Logic Elements | 25,660 | — |
| Configurable Logic Blocks (CLBs) | 2,566 | — |
| Total RAM Bits | 1,944,576 | 1,944,576 |
| Number of Logic Array Blocks (LABs) | 455 | — |
| Maximum Internal Clock Frequency | 4385.97 MHz | — |
| Combinatorial CLB Delay (max) | 9.48 ns | — |
| Process Technology | CMOS 130 nm | 0.13 µm CMOS, SRAM-based |
| Nominal Supply Voltage | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Operating Temperature Grade | MILITARY / Industrial | — |
| Speed Grade | I7 (slowest industrial) | C7 (moderate Fmax bin) |
| Package Code | DF (672-ball FC-FBGA) | — |
| Number of Terminals | 672 | — |
| Terminal Form | Ball (BGA) | — |
| Package Shape | Square | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Elements (LE) | — | 25,660 |
| Logic Array Blocks (LABs) | — | 2,566 |
| User I/O Count | — | 455 |
| Embedded DSP Blocks | — | 14 |
| Embedded Transceivers | — | Yes (GX family) |
| Core Supply Voltage | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Temperatura de funcionamiento | — | 0 °C to +85 °C (Commercial) |
| Encapsulado | — | 672-FBGA (27 × 27 mm, 1.0 mm pitch) |
| Lead Free / RoHS | — | Lead-Free, RoHS Compliant |
| PLL Count | — | [DATA_NEEDED: PLL count] |