EP1SGX25DF672I7 vs EP1SGX25DF672I5N Vergleich

Detaillierter Direktvergleich von EP1SGX25DF672I7 von Intel und EP1SGX25DF672I5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP1SGX25DF672I5N EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES

EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES

EP1SGX25DF672I5N ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP1SGX25DF672I7 EP1SGX25DF672I5N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.190,00 $118,00
Series Stratix GX —
Family Stratix GX (EP1SGX25) Stratix GX
Logic Elements 25,660 25,660
Configurable Logic Blocks (CLBs) 2,566 —
Total RAM Bits 1,944,576 —
Number of Logic Array Blocks (LABs) 455 —
Maximum Internal Clock Frequency 4385.97 MHz —
Combinatorial CLB Delay (max) 9.48 ns —
Process Technology CMOS 130 nm 130 nm CMOS
Nominal Supply Voltage 1.5 V —
Supply Voltage Range 1.425 V to 1.575 V —
Operating Temperature Grade MILITARY / Industrial —
Speed Grade I7 (slowest industrial) —
Package Code DF (672-ball FC-FBGA) —
Number of Terminals 672 —
Terminal Form Ball (BGA) —
Package Shape Square —
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status [DATA_NEEDED: RoHS status] Compliant
Logic Cells (CLBs) — 2,566
Core Supply Voltage — 1.5 V
High-Speed Transceiver Channels — 4 to 20 (CDR/SERDES)
Max Transceiver Data Rate — 3.1875 Gbps
Gehäuse — 672-ball FC-FBGA
Package Body Size — 33 x 33 mm
Ball Pitch — 1.0 mm
Betriebstemperatur — -40C to +85C (Industrial)
Lead-Free — Yes
Logic Family — CMOS (SRAM-based FPGA)
Total I/O Pins — [DATA_NEEDED: total user I/O pin count]
Embedded Memory — [DATA_NEEDED: TriMatrix memory block count]

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