EP1SGX25DF672I7 vs EP1SGX25DF672I5N 对比

详细并排对比 EP1SGX25DF672I7 出自 Intel 和 EP1SGX25DF672I5N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP1SGX25DF672I5N EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES

EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES

EP1SGX25DF672I5N ⚠ 最后一次采购

规格对比

参数 EP1SGX25DF672I7 EP1SGX25DF672I5N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete 最后采购期
库存状态 有库存 有库存
单价(USD) $1,190.00 $118.00
Series Stratix GX —
Family Stratix GX (EP1SGX25) Stratix GX
Logic Elements 25,660 25,660
Configurable Logic Blocks (CLBs) 2,566 —
Total RAM Bits 1,944,576 —
Number of Logic Array Blocks (LABs) 455 —
Maximum Internal Clock Frequency 4385.97 MHz —
Combinatorial CLB Delay (max) 9.48 ns —
Process Technology CMOS 130 nm 130 nm CMOS
Nominal Supply Voltage 1.5 V —
Supply Voltage Range 1.425 V to 1.575 V —
Operating Temperature Grade MILITARY / Industrial —
Speed Grade I7 (slowest industrial) —
Package Code DF (672-ball FC-FBGA) —
Number of Terminals 672 —
Terminal Form Ball (BGA) —
Package Shape Square —
安装类型 Surface Mount (BGA) Surface Mount
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
Logic Cells (CLBs) — 2,566
Core Supply Voltage — 1.5 V
High-Speed Transceiver Channels — 4 to 20 (CDR/SERDES)
Max Transceiver Data Rate — 3.1875 Gbps
封装 — 672-ball FC-FBGA
Package Body Size — 33 x 33 mm
Ball Pitch — 1.0 mm
工作温度 — -40C to +85C (Industrial)
Lead-Free — Yes
Logic Family — CMOS (SRAM-based FPGA)
Total I/O Pins — [DATA_NEEDED: total user I/O pin count]
Embedded Memory — [DATA_NEEDED: TriMatrix memory block count]

数据手册与资源

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