EP1SGX25DF672I7N vs EP1SGX25F672C7N Vergleich
Detaillierter Direktvergleich von EP1SGX25DF672I7N von Intel und EP1SGX25F672C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1SGX25DF672I7N | EP1SGX25F672C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $162,00 | $215,00 |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | 25,660 |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | CMOS |
| High-Speed Transceiver Channels | 4 | — |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | 3.125 Gbps |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Gehäuse | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | 672-ball FineLine BGA (FBGA672), 1.00 mm pitch |
| Logic Family | CMOS | — |
| Betriebstemperatur | 0 °C to 85 °C (industrial) | — |
| Lead-Free | Yes | — |
| RoHS-Status | [DATA_NEEDED: rohs status] | Compliant (lead-free FBGA) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 672 | — |
| Configurable Logic Blocks (CLBs) | — | 2,566 |
| Embedded Memory (bits) | — | 1,944,576 |
| Number of I/O Banks | — | 4 |
| Maximum User I/O | — | [DATA_NEEDED: max user I/O pins] |
| Number of Registers | — | 25,660 |
| Number of Transceivers | — | Up to 20 |
| Operating Supply Voltage (Core) | — | 1.5 V nominal |
| Betriebstemperaturbereich | — | 0°C to 85°C (commercial) |
| MSL-Level | — | 3 |