EP1SGX25DF672I7N vs EP1SGX25F672C7N Comparación
Comparación detallada lado a lado de EP1SGX25DF672I7N por Intel y EP1SGX25F672C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1SGX25DF672I7N | EP1SGX25F672C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $162,00 | $215,00 |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | 25,660 |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | CMOS |
| High-Speed Transceiver Channels | 4 | — |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | 3.125 Gbps |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Encapsulado | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | 672-ball FineLine BGA (FBGA672), 1.00 mm pitch |
| Logic Family | CMOS | — |
| Temperatura de funcionamiento | 0 °C to 85 °C (industrial) | — |
| Lead-Free | Yes | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | Compliant (lead-free FBGA) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 672 | — |
| Configurable Logic Blocks (CLBs) | — | 2,566 |
| Embedded Memory (bits) | — | 1,944,576 |
| Number of I/O Banks | — | 4 |
| Maximum User I/O | — | [DATA_NEEDED: max user I/O pins] |
| Number of Registers | — | 25,660 |
| Number of Transceivers | — | Up to 20 |
| Operating Supply Voltage (Core) | — | 1.5 V nominal |
| Rango de temperatura de funcionamiento | — | 0°C to 85°C (commercial) |
| Nivel MSL | — | 3 |