EP1SGX25DF800C5N vs EP1SGX25DF800C6N Vergleich

Detaillierter Direktvergleich von EP1SGX25DF800C5N von Intel und EP1SGX25DF800C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1SGX25DF800C5N EP1SGX25DF800C6N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $158,00 $118,00
Family Stratix GX Stratix GX
Device Logic Elements 25,660 (typical) —
Transceiver Channels 8 (full-duplex) —
Maximum Transceiver Data Rate 3.1875 Gbps per channel 3.1875 Gbps
Process Technology 130 nm —
Supply Voltage (Core) 1.5 V typical —
Gehäuse FBGA-800 (FineLine BGA, 31x31 mm) FBGA-780 (FineLine BGA, 800-ball per JEDEC ordering code)
Speed Grade C5 (commercial) 6
Betriebstemperatur 0C to +85C (commercial) Commercial (0 C to +85 C)
Lead-Free / RoHS Status Lead-free (N suffix) —
On-Chip Memory (TriMatrix) Approx. 2 Mbits total —
PLLs Up to 40 (device-wide) —
Embedded 8b/10b Encoder/Decoder Yes (one per transceiver channel) —
PCI Express Hard IP x1, x4 endpoints supported —
DSP Blocks Embedded multiplier blocks (family-wide) Yes, embedded multiplier blocks
Montageart Surface Mount (BGA) Surface Mount (BGA)
MSL-Level [DATA_NEEDED: MSL Level] —
Development Software Quartus II (legacy) —
Logic Elements — 25,560 LEs
Maximum Transceiver Channels — 20 channels
Process Node — [DATA_NEEDED: process node]
Core Voltage — 1.5 V
Configuration Method — Passive Serial / Passive Parallel / Active Serial / JTAG
Transceiver Encoding — 8B/10B
Clock Data Recovery (CDR) — Yes, integrated per channel
Speichertyp — TriMatrix embedded SRAM
RoHS-Status — [DATA_NEEDED: RoHS status]
Lead Free — [DATA_NEEDED: lead free status]

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