EP20K100CF324C7 vs EP20K100CF144C9 Vergleich
Detaillierter Direktvergleich von EP20K100CF324C7 von Intel und EP20K100CF144C9 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP20K100CF324C7 | EP20K100CF144C9 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $27,80 | $49,00 |
| Family | FLEX 10K | APEX-20K |
| Series | EP20K100 | — |
| Logic Elements (LEs) | 4,160 | — |
| System Gates | 100,000 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Maximum RAM Bits | 49,152 | — |
| Maximum User I/O | 246 | — |
| Gehäuse | 324-FBGA (FineLine BGA) | 144-LQFP |
| Supply Voltage - Core | 1.8 V | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Betriebstemperatur | 0 °C to +70 °C (commercial) | — |
| Speed Grade | C7 (slowest commercial bin) | C9 (commercial) |
| Process Technology | 0.22 µm CMOS SRAM | — |
| Configuration Method | Serial PROM (EPC2/EPC4/EPC8) or JTAG | SRAM / JTAG (IEEE 1149.1) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | unknown | — |
| Device Logic Elements | — | 4,160 |
| Typical Gates | — | 100,000 |
| Embedded System Blocks (ESBs) | — | 4 |
| Maximum User I/O Pins | — | 93 |
| Embedded RAM Bits | — | 53,248 |
| Pin Pitch | — | 0.5 mm [DATA_NEEDED: confirm pitch, datasheet quotes 0.5 mm for LQFP-144] |
| Core Voltage | — | 2.5 V |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+ [DATA_NEEDED: full list per datasheet I/O chapter] |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Lead-Free / RoHS | — | [DATA_NEEDED: not stated in distributor snippets] |