EP20K100CF324C7 vs EP20K100CF144C9 Comparación
Comparación detallada lado a lado de EP20K100CF324C7 por Intel y EP20K100CF144C9 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K100CF324C7 | EP20K100CF144C9 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,80 | $49,00 |
| Family | FLEX 10K | APEX-20K |
| Series | EP20K100 | — |
| Logic Elements (LEs) | 4,160 | — |
| System Gates | 100,000 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Maximum RAM Bits | 49,152 | — |
| Maximum User I/O | 246 | — |
| Encapsulado | 324-FBGA (FineLine BGA) | 144-LQFP |
| Supply Voltage - Core | 1.8 V | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Temperatura de funcionamiento | 0 °C to +70 °C (commercial) | — |
| Speed Grade | C7 (slowest commercial bin) | C9 (commercial) |
| Process Technology | 0.22 µm CMOS SRAM | — |
| Configuration Method | Serial PROM (EPC2/EPC4/EPC8) or JTAG | SRAM / JTAG (IEEE 1149.1) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | unknown | — |
| Device Logic Elements | — | 4,160 |
| Typical Gates | — | 100,000 |
| Embedded System Blocks (ESBs) | — | 4 |
| Maximum User I/O Pins | — | 93 |
| Embedded RAM Bits | — | 53,248 |
| Pin Pitch | — | 0.5 mm [DATA_NEEDED: confirm pitch, datasheet quotes 0.5 mm for LQFP-144] |
| Core Voltage | — | 2.5 V |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+ [DATA_NEEDED: full list per datasheet I/O chapter] |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Lead-Free / RoHS | — | [DATA_NEEDED: not stated in distributor snippets] |