EP20K100CF324C7 vs EP20K100CF144C9 Comparaison
Comparaison détaillée côte à côte de EP20K100CF324C7 par Intel et EP20K100CF144C9 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K100CF324C7 | EP20K100CF144C9 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $27,80 | $49,00 |
| Family | FLEX 10K | APEX-20K |
| Series | EP20K100 | — |
| Logic Elements (LEs) | 4,160 | — |
| System Gates | 100,000 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Maximum RAM Bits | 49,152 | — |
| Maximum User I/O | 246 | — |
| Boîtier | 324-FBGA (FineLine BGA) | 144-LQFP |
| Supply Voltage - Core | 1.8 V | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Température de fonctionnement | 0 °C to +70 °C (commercial) | — |
| Speed Grade | C7 (slowest commercial bin) | C9 (commercial) |
| Process Technology | 0.22 µm CMOS SRAM | — |
| Configuration Method | Serial PROM (EPC2/EPC4/EPC8) or JTAG | SRAM / JTAG (IEEE 1149.1) |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Statut RoHS | unknown | — |
| Device Logic Elements | — | 4,160 |
| Typical Gates | — | 100,000 |
| Embedded System Blocks (ESBs) | — | 4 |
| Maximum User I/O Pins | — | 93 |
| Embedded RAM Bits | — | 53,248 |
| Pin Pitch | — | 0.5 mm [DATA_NEEDED: confirm pitch, datasheet quotes 0.5 mm for LQFP-144] |
| Core Voltage | — | 2.5 V |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+ [DATA_NEEDED: full list per datasheet I/O chapter] |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Lead-Free / RoHS | — | [DATA_NEEDED: not stated in distributor snippets] |