EP20K400FI784-3 vs EP20K400FC784-3 Vergleich
Detaillierter Direktvergleich von EP20K400FI784-3 von Intel und EP20K400FC784-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP20K400FI784-3 | EP20K400FC784-3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $155,00 | $175,00 |
| Family | APEX 20K | APEX 20K (MultiCore) |
| Typical Gate Count | 400,000 gates | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | 21,168 |
| Dedicated Inputs | 4 | — |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | 100 |
| Maximum User I/O | [DATA_NEEDED: user I/O count] | — |
| Supply Voltage (Nominal) | 2.5 V | — |
| Supply Voltage Range | 2.375 V to 2.625 V | — |
| Speed Grade | -3 (slowest) | -3 |
| Betriebstemperatur | -40 °C to +100 °C (industrial) | Commercial (0°C to +85°C) |
| Gehäuse | 784-ball PBGA (Fine-pitch BGA) | 784-ball FineLine BGA (FC) |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Terminal Pitch | 1.000 mm | — |
| Seated Height (max) | 2.7000 mm | — |
| Body Material | Plastic / Epoxy | — |
| MSL-Level | 3 | [DATA_NEEDED: MSL rating] |
| Configuration Method | SRAM (external EPROM required) | Serial or parallel, SRAM-based |
| Montageart | Surface Mount | — |
| Process Technology | 0.18 µm CMOS SRAM | 0.18 µm CMOS |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Typical Gates | — | 400,000 |
| Maximum System Gates | — | 1,052,000 |
| Maximum RAM Bits | — | 212,992 |
| PLLs | — | 4 |
| User I/O Pins | — | 488 |
| I/O Standards | — | MultiVolt I/O: 1.8V, 2.5V, 3.3V, 5.0V |
| Core Voltage | — | [DATA_NEEDED: core voltage] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |