EP20K400FI784-3 vs EP20K400FC784-3 비교
다음의 상세 나란히 비교: EP20K400FI784-3 제조: Intel 및 EP20K400FC784-3 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP20K400FI784-3 | EP20K400FC784-3 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Obsolete | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $155.00 | $175.00 |
| Family | APEX 20K | APEX 20K (MultiCore) |
| Typical Gate Count | 400,000 gates | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | 21,168 |
| Dedicated Inputs | 4 | — |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | 100 |
| Maximum User I/O | [DATA_NEEDED: user I/O count] | — |
| Supply Voltage (Nominal) | 2.5 V | — |
| Supply Voltage Range | 2.375 V to 2.625 V | — |
| Speed Grade | -3 (slowest) | -3 |
| 동작 온도 | -40 °C to +100 °C (industrial) | Commercial (0°C to +85°C) |
| 패키지 | 784-ball PBGA (Fine-pitch BGA) | 784-ball FineLine BGA (FC) |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Terminal Pitch | 1.000 mm | — |
| Seated Height (max) | 2.7000 mm | — |
| Body Material | Plastic / Epoxy | — |
| MSL 레벨 | 3 | [DATA_NEEDED: MSL rating] |
| Configuration Method | SRAM (external EPROM required) | Serial or parallel, SRAM-based |
| 실장 유형 | Surface Mount | — |
| Process Technology | 0.18 µm CMOS SRAM | 0.18 µm CMOS |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Typical Gates | — | 400,000 |
| Maximum System Gates | — | 1,052,000 |
| Maximum RAM Bits | — | 212,992 |
| PLLs | — | 4 |
| User I/O Pins | — | 488 |
| I/O Standards | — | MultiVolt I/O: 1.8V, 2.5V, 3.3V, 5.0V |
| Core Voltage | — | [DATA_NEEDED: core voltage] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |