EP20K400FI784-3 vs EP20K400FC784-3 Comparaison
Comparaison détaillée côte à côte de EP20K400FI784-3 par Intel et EP20K400FC784-3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K400FI784-3 | EP20K400FC784-3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $155,00 | $175,00 |
| Family | APEX 20K | APEX 20K (MultiCore) |
| Typical Gate Count | 400,000 gates | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | 21,168 |
| Dedicated Inputs | 4 | — |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | 100 |
| Maximum User I/O | [DATA_NEEDED: user I/O count] | — |
| Supply Voltage (Nominal) | 2.5 V | — |
| Supply Voltage Range | 2.375 V to 2.625 V | — |
| Speed Grade | -3 (slowest) | -3 |
| Température de fonctionnement | -40 °C to +100 °C (industrial) | Commercial (0°C to +85°C) |
| Boîtier | 784-ball PBGA (Fine-pitch BGA) | 784-ball FineLine BGA (FC) |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Terminal Pitch | 1.000 mm | — |
| Seated Height (max) | 2.7000 mm | — |
| Body Material | Plastic / Epoxy | — |
| Niveau MSL | 3 | [DATA_NEEDED: MSL rating] |
| Configuration Method | SRAM (external EPROM required) | Serial or parallel, SRAM-based |
| Type de montage | Surface Mount | — |
| Process Technology | 0.18 µm CMOS SRAM | 0.18 µm CMOS |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Typical Gates | — | 400,000 |
| Maximum System Gates | — | 1,052,000 |
| Maximum RAM Bits | — | 212,992 |
| PLLs | — | 4 |
| User I/O Pins | — | 488 |
| I/O Standards | — | MultiVolt I/O: 1.8V, 2.5V, 3.3V, 5.0V |
| Core Voltage | — | [DATA_NEEDED: core voltage] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |