EP20K600CF672I9 vs EP20K600CF672C9 Vergleich

Detaillierter Direktvergleich von EP20K600CF672I9 von Intel und EP20K600CF672C9 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP20K600CF672I9 EP20K600CF672C9
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $152,00 $171,00
Family APEX 20KC —
Logic Elements / Cells 24,320 —
System Gates 600,000 —
Maximum Operating Frequency 250 MHz —
Process Technology 0.15 µm CMOS 0.15 µm all-layer copper-metal
Core Voltage 1.8 V 1.8 V
Gehäuse 672-pin FC-FBGA —
Montageart Surface Mount (BGA) —
Temperature Grade Industrial (-40°C to +85°C) —
Speed Grade 9 (fastest bin) —
User I/O Pins 311 (max) —
Embedded Array Blocks (EABs) [DATA_NEEDED: EAB count] —
Embedded Memory [DATA_NEEDED: total RAM bits] —
PLLs Up to 4 —
I/O Standards Supported LVTTL, LVCMOS, PCI, LVDS —
Configuration Mode Passive Serial / JTAG —
Maximum Seated Height 2.1 mm —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
MSL-Level [DATA_NEEDED: MSL level] —
Lead-Free [DATA_NEEDED: lead-free] —
Device Family — APEX 20KC
Typical Gate Count — 600,000 gates
Logic Elements (LEs) — 24,320
Maximum User I/O — 488 pins
Embedded Memory (EAB) — 311 Kbits
Propagation Delay — 1.48 ns
Maximum Internal Frequency — 250 MHz
Package Type — 672-pin FC-FBGA
Package Dimensions — 45 x 45 mm, 1.27 mm pitch
Total Pin Count — 652 balls
Betriebstemperatur — 0 °C to +85 °C (commercial)
Configuration Interface — IEEE 1149.1 JTAG / passive serial / EPC configuration

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