EP2A15B652C7 vs EP2A15B652C9 Vergleich
Detaillierter Direktvergleich von EP2A15B652C7 von Intel und EP2A15B652C9 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A15B652C7 | EP2A15B652C9 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $82,40 | $195,00 |
| Family | APEX II | APEX II |
| Logic Elements | 30000 (approx) | 15,600 |
| Typical Gates | 1.5 million | — |
| Maximum User I/O Pins | [DATA_NEEDED: exact user I/O count] | — |
| Process Technology | 0.18 micron CMOS | — |
| Embedded System Blocks (ESB) | Yes - configurable as RAM/ROM or product-term logic | — |
| Supply Voltage - Core | [DATA_NEEDED: VCCINT voltage] | — |
| Supply Voltage - I/O | [DATA_NEEDED: VCCIO voltage] | — |
| Configuration Method | SRAM-based, requires external configuration memory | SRAM-based, JTAG 1149.1 boundary scan |
| Speed Grade | -7 | -9 (fastest APEX II commercial) |
| Betriebstemperatur | 0C to +85C (commercial, suffix C7) | 0 C to +85 C (commercial) |
| Gehäuse | 652-ball BGA | 652-ball FineLine BGA |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Hot Socketing Support | Yes (MultiCore hot-socketing) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status - legacy APEX II family] | Compliant |
| Design Tool | Quartus II (legacy) | — |
| Embedded System Blocks | — | 425 Kbits |
| Number of DLLs/PLLs | — | 4 PLUs |
| Core Voltage | — | 1.5 V |
| I/O Voltage Standards | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V (LVTTL, LVCMOS, LVDS, SSTL, HSTL) |
| Programming File Format | — | .pof / .sof (Quartus) |
| MSL-Level | — | 3 (168 hours) |
| Lead-Free | — | Yes |
| Lebenszyklusstatus | — | Obsolete - new design not recommended |