EP2A15B652C7 vs EP2A15B652C9 Comparación
Comparación detallada lado a lado de EP2A15B652C7 por Intel y EP2A15B652C9 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A15B652C7 | EP2A15B652C9 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $82,40 | $195,00 |
| Family | APEX II | APEX II |
| Logic Elements | 30000 (approx) | 15,600 |
| Typical Gates | 1.5 million | — |
| Maximum User I/O Pins | [DATA_NEEDED: exact user I/O count] | — |
| Process Technology | 0.18 micron CMOS | — |
| Embedded System Blocks (ESB) | Yes - configurable as RAM/ROM or product-term logic | — |
| Supply Voltage - Core | [DATA_NEEDED: VCCINT voltage] | — |
| Supply Voltage - I/O | [DATA_NEEDED: VCCIO voltage] | — |
| Configuration Method | SRAM-based, requires external configuration memory | SRAM-based, JTAG 1149.1 boundary scan |
| Speed Grade | -7 | -9 (fastest APEX II commercial) |
| Temperatura de funcionamiento | 0C to +85C (commercial, suffix C7) | 0 C to +85 C (commercial) |
| Encapsulado | 652-ball BGA | 652-ball FineLine BGA |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Hot Socketing Support | Yes (MultiCore hot-socketing) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status - legacy APEX II family] | Compliant |
| Design Tool | Quartus II (legacy) | — |
| Embedded System Blocks | — | 425 Kbits |
| Number of DLLs/PLLs | — | 4 PLUs |
| Core Voltage | — | 1.5 V |
| I/O Voltage Standards | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V (LVTTL, LVCMOS, LVDS, SSTL, HSTL) |
| Programming File Format | — | .pof / .sof (Quartus) |
| Nivel MSL | — | 3 (168 hours) |
| Lead-Free | — | Yes |
| Estado del ciclo de vida | — | Obsolete - new design not recommended |