EP2A15B652C7 vs EP2A15B652C9 Comparaison
Comparaison détaillée côte à côte de EP2A15B652C7 par Intel et EP2A15B652C9 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A15B652C7 | EP2A15B652C9 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $82,40 | $195,00 |
| Family | APEX II | APEX II |
| Logic Elements | 30000 (approx) | 15,600 |
| Typical Gates | 1.5 million | — |
| Maximum User I/O Pins | [DATA_NEEDED: exact user I/O count] | — |
| Process Technology | 0.18 micron CMOS | — |
| Embedded System Blocks (ESB) | Yes - configurable as RAM/ROM or product-term logic | — |
| Supply Voltage - Core | [DATA_NEEDED: VCCINT voltage] | — |
| Supply Voltage - I/O | [DATA_NEEDED: VCCIO voltage] | — |
| Configuration Method | SRAM-based, requires external configuration memory | SRAM-based, JTAG 1149.1 boundary scan |
| Speed Grade | -7 | -9 (fastest APEX II commercial) |
| Température de fonctionnement | 0C to +85C (commercial, suffix C7) | 0 C to +85 C (commercial) |
| Boîtier | 652-ball BGA | 652-ball FineLine BGA |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Hot Socketing Support | Yes (MultiCore hot-socketing) | — |
| Statut RoHS | [DATA_NEEDED: RoHS status - legacy APEX II family] | Compliant |
| Design Tool | Quartus II (legacy) | — |
| Embedded System Blocks | — | 425 Kbits |
| Number of DLLs/PLLs | — | 4 PLUs |
| Core Voltage | — | 1.5 V |
| I/O Voltage Standards | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V (LVTTL, LVCMOS, LVDS, SSTL, HSTL) |
| Programming File Format | — | .pof / .sof (Quartus) |
| Niveau MSL | — | 3 (168 hours) |
| Lead-Free | — | Yes |
| Statut du cycle de vie | — | Obsolete - new design not recommended |