EP2A15B652C7 vs EP2A15F672C7N Vergleich
Detaillierter Direktvergleich von EP2A15B652C7 von Intel und EP2A15F672C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A15B652C7 | EP2A15F672C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $82,40 | $171,00 |
| Family | APEX II | APEX II |
| Logic Elements | 30000 (approx) | — |
| Typical Gates | 1.5 million | — |
| Maximum User I/O Pins | [DATA_NEEDED: exact user I/O count] | — |
| Process Technology | 0.18 micron CMOS | 0.15 µm all-layer copper CMOS |
| Embedded System Blocks (ESB) | Yes - configurable as RAM/ROM or product-term logic | — |
| Supply Voltage - Core | [DATA_NEEDED: VCCINT voltage] | — |
| Supply Voltage - I/O | [DATA_NEEDED: VCCIO voltage] | — |
| Configuration Method | SRAM-based, requires external configuration memory | — |
| Speed Grade | -7 | -7 |
| Betriebstemperatur | 0C to +85C (commercial, suffix C7) | Commercial (0C to +85C) |
| Gehäuse | 652-ball BGA | 672-ball FC-FBGA (FineLine BGA) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Hot Socketing Support | Yes (MultiCore hot-socketing) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status - legacy APEX II family] | [DATA_NEEDED: RoHS status] |
| Design Tool | Quartus II (legacy) | — |
| Logic Elements (Cells) | — | 16,640 |
| Embedded Memory Bits | — | 425,984 |
| User I/Os | — | 492 |
| Metal Layers | — | Up to 8 |
| Core Voltage | — | 1.5 V |
| Maximum Internal Frequency | — | 500 MHz |
| I/O Standards Supported | — | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL |
| LVDS Data Rate | — | Up to 1 Gbps (True-LVDS) |
| Configuration Methods | — | JTAG, Passive Serial |