EP2A15B652C7 vs EP2A15F672C7N Comparación
Comparación detallada lado a lado de EP2A15B652C7 por Intel y EP2A15F672C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A15B652C7 | EP2A15F672C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $82,40 | $171,00 |
| Family | APEX II | APEX II |
| Logic Elements | 30000 (approx) | — |
| Typical Gates | 1.5 million | — |
| Maximum User I/O Pins | [DATA_NEEDED: exact user I/O count] | — |
| Process Technology | 0.18 micron CMOS | 0.15 µm all-layer copper CMOS |
| Embedded System Blocks (ESB) | Yes - configurable as RAM/ROM or product-term logic | — |
| Supply Voltage - Core | [DATA_NEEDED: VCCINT voltage] | — |
| Supply Voltage - I/O | [DATA_NEEDED: VCCIO voltage] | — |
| Configuration Method | SRAM-based, requires external configuration memory | — |
| Speed Grade | -7 | -7 |
| Temperatura de funcionamiento | 0C to +85C (commercial, suffix C7) | Commercial (0C to +85C) |
| Encapsulado | 652-ball BGA | 672-ball FC-FBGA (FineLine BGA) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Hot Socketing Support | Yes (MultiCore hot-socketing) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status - legacy APEX II family] | [DATA_NEEDED: RoHS status] |
| Design Tool | Quartus II (legacy) | — |
| Logic Elements (Cells) | — | 16,640 |
| Embedded Memory Bits | — | 425,984 |
| User I/Os | — | 492 |
| Metal Layers | — | Up to 8 |
| Core Voltage | — | 1.5 V |
| Maximum Internal Frequency | — | 500 MHz |
| I/O Standards Supported | — | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL |
| LVDS Data Rate | — | Up to 1 Gbps (True-LVDS) |
| Configuration Methods | — | JTAG, Passive Serial |