EP2A15B724C9 vs EP2A15B724C8 Vergleich
Detaillierter Direktvergleich von EP2A15B724C9 von Intel und EP2A15B724C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A15B724C9 | EP2A15B724C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $268,50 | $185,00 |
| Series | APEX II | — |
| Family | APEX II (EP2A15) | APEX II |
| Logic Elements | 16640 | 16,640 |
| Number of Gates | 600000 | — |
| Embedded Memory (RAM bits) | 425984 | — |
| User I/O Count | 492 | — |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltages Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) | 0.15 µm all-layer copper, up to 8 metal layers |
| Maximum Internal Frequency | 500 MHz | 435 MHz |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | — |
| Interface Standards | LVDS, LVPECL, PCML, HyperTransport | — |
| Embedded Memory Type | ESB - dual-port RAM / ROM / FIFO / CAM | — |
| Clock Management | On-chip PLLs | — |
| Gehäuse | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) | 724-pin FCBGA (flip-chip BGA) |
| Betriebstemperatur | Commercial (0 °C to +85 °C) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS status] | unknown |
| Manufacturer | — | Intel (formerly Altera) |
| System Gates | — | 600,000 |
| Embedded RAM Bits | — | 425,984 |
| User I/O | — | 492 |
| Pin-to-Pin Logic Delay (tPD) | — | 1.94 ns |
| Core Voltage | — | 1.5 V |
| High-Speed Serial Support | — | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport |
| PLLs | — | 4 |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature grade] |