EP2A15B724C9 vs EP2A15B724C8 对比
详细并排对比 EP2A15B724C9 出自 Intel 和 EP2A15B724C8 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2A15B724C9 | EP2A15B724C8 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $268.50 | $185.00 |
| Series | APEX II | — |
| Family | APEX II (EP2A15) | APEX II |
| Logic Elements | 16640 | 16,640 |
| Number of Gates | 600000 | — |
| Embedded Memory (RAM bits) | 425984 | — |
| User I/O Count | 492 | — |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltages Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) | 0.15 µm all-layer copper, up to 8 metal layers |
| Maximum Internal Frequency | 500 MHz | 435 MHz |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | — |
| Interface Standards | LVDS, LVPECL, PCML, HyperTransport | — |
| Embedded Memory Type | ESB - dual-port RAM / ROM / FIFO / CAM | — |
| Clock Management | On-chip PLLs | — |
| 封装 | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) | 724-pin FCBGA (flip-chip BGA) |
| 工作温度 | Commercial (0 °C to +85 °C) | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | unknown |
| Manufacturer | — | Intel (formerly Altera) |
| System Gates | — | 600,000 |
| Embedded RAM Bits | — | 425,984 |
| User I/O | — | 492 |
| Pin-to-Pin Logic Delay (tPD) | — | 1.94 ns |
| Core Voltage | — | 1.5 V |
| High-Speed Serial Support | — | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport |
| PLLs | — | 4 |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |
| 工作温度范围 | — | [DATA_NEEDED: operating temperature grade] |