EP2A15F672C7AA vs EP2A15F672C9N Vergleich
Detaillierter Direktvergleich von EP2A15F672C7AA von Intel und EP2A15F672C9N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2A15F672C7AA - APEX II FPGA 600K Gates 1.5V FC-FBGA672
EP2A15F672C7AA ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2A15F672C7AA | EP2A15F672C9N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $215,00 | $155,00 |
| Family | APEX II | — |
| Typical Gates | 600K | — |
| Maximum System Gates | 1.4M | — |
| Logic Elements (LEs) | 16,640 | — |
| Maximum User I/O | 492 | — |
| Operating Frequency (internal) | 500 MHz | — |
| LVDS Data Rate | 1 Gbps True-LVDS | — |
| Core Voltage | 1.5 V | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, PCI-X, SSTL, HSTL, LVDS, LVPECL, PCML, HyperTransport | — |
| MultiVolt I/O Bank Voltages | 1.5V / 1.8V / 2.5V / 3.3V | — |
| Embedded Memory | Dual-port RAM blocks + CAM blocks | Embedded dual-port RAM blocks |
| PLLs | 4 enhanced PLLs | — |
| Gehäuse | 672-ball FC-FBGA (flip-chip) | 672-ball FC-FBGA (27 x 27 mm, 1 mm pitch, FineLine BGA) |
| Process Technology | 0.15 micrometer all-layer copper (up to 8 metal layers) | — |
| Programming Interfaces | Passive Serial, Fast Passive Parallel, JTAG (IEEE 1149.1) | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Lifecycle | Last-Time-Buy / EOL announced Nov-Dec 2016 | — |
| RoHS-Status | Compliant (per Full-Electronic listing) | [DATA_NEEDED: RoHS compliance status] |
| Logic Family | — | APEX II (CMOS) |
| Series | — | Altera APEX II (EP2A) |
| Logic Elements / Cells | — | 16,640 |
| Equivalent Gates | — | 600,000 |
| Maximum User I/O Pins | — | 492 |
| Propagation Delay | — | 1.94 ns |
| Internal Operating Frequency (max) | — | 379 MHz |
| Technology Process | — | 0.15 µm all-layer copper CMOS, up to 8 metal layers |
| Core Supply Voltage | — | 1.5 V |
| Betriebstemperatur | — | 0°C to +85°C (commercial grade) |
| Montageart | — | Surface Mount |
| MSL-Level | — | 3 (per FC-FBGA moisture sensitivity, typical) |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: lead-free status] |
| I/O Speed Grade | — | Up to 1 Gbps (LVDS) |
| Special Blocks | — | CAM (Content-Addressable Memory), dedicated multipliers, PLLs |
| Speed Grade | — | C9 (fastest commercial grade in the APEX II speed-grade system) |