EP2A15F672C7AA vs EP2A15F672C9N Comparaison
Comparaison détaillée côte à côte de EP2A15F672C7AA par Intel et EP2A15F672C9N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A15F672C7AA | EP2A15F672C9N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $215,00 | $155,00 |
| Family | APEX II | — |
| Typical Gates | 600K | — |
| Maximum System Gates | 1.4M | — |
| Logic Elements (LEs) | 16,640 | — |
| Maximum User I/O | 492 | — |
| Operating Frequency (internal) | 500 MHz | — |
| LVDS Data Rate | 1 Gbps True-LVDS | — |
| Core Voltage | 1.5 V | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, PCI-X, SSTL, HSTL, LVDS, LVPECL, PCML, HyperTransport | — |
| MultiVolt I/O Bank Voltages | 1.5V / 1.8V / 2.5V / 3.3V | — |
| Embedded Memory | Dual-port RAM blocks + CAM blocks | Embedded dual-port RAM blocks |
| PLLs | 4 enhanced PLLs | — |
| Boîtier | 672-ball FC-FBGA (flip-chip) | 672-ball FC-FBGA (27 x 27 mm, 1 mm pitch, FineLine BGA) |
| Process Technology | 0.15 micrometer all-layer copper (up to 8 metal layers) | — |
| Programming Interfaces | Passive Serial, Fast Passive Parallel, JTAG (IEEE 1149.1) | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Lifecycle | Last-Time-Buy / EOL announced Nov-Dec 2016 | — |
| Statut RoHS | Compliant (per Full-Electronic listing) | [DATA_NEEDED: RoHS compliance status] |
| Logic Family | — | APEX II (CMOS) |
| Series | — | Altera APEX II (EP2A) |
| Logic Elements / Cells | — | 16,640 |
| Equivalent Gates | — | 600,000 |
| Maximum User I/O Pins | — | 492 |
| Propagation Delay | — | 1.94 ns |
| Internal Operating Frequency (max) | — | 379 MHz |
| Technology Process | — | 0.15 µm all-layer copper CMOS, up to 8 metal layers |
| Core Supply Voltage | — | 1.5 V |
| Température de fonctionnement | — | 0°C to +85°C (commercial grade) |
| Type de montage | — | Surface Mount |
| Niveau MSL | — | 3 (per FC-FBGA moisture sensitivity, typical) |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: lead-free status] |
| I/O Speed Grade | — | Up to 1 Gbps (LVDS) |
| Special Blocks | — | CAM (Content-Addressable Memory), dedicated multipliers, PLLs |
| Speed Grade | — | C9 (fastest commercial grade in the APEX II speed-grade system) |