EP2A15F672C7AA vs EP2A15F672C9N Comparación
Comparación detallada lado a lado de EP2A15F672C7AA por Intel y EP2A15F672C9N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A15F672C7AA | EP2A15F672C9N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $215,00 | $155,00 |
| Family | APEX II | — |
| Typical Gates | 600K | — |
| Maximum System Gates | 1.4M | — |
| Logic Elements (LEs) | 16,640 | — |
| Maximum User I/O | 492 | — |
| Operating Frequency (internal) | 500 MHz | — |
| LVDS Data Rate | 1 Gbps True-LVDS | — |
| Core Voltage | 1.5 V | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, PCI-X, SSTL, HSTL, LVDS, LVPECL, PCML, HyperTransport | — |
| MultiVolt I/O Bank Voltages | 1.5V / 1.8V / 2.5V / 3.3V | — |
| Embedded Memory | Dual-port RAM blocks + CAM blocks | Embedded dual-port RAM blocks |
| PLLs | 4 enhanced PLLs | — |
| Encapsulado | 672-ball FC-FBGA (flip-chip) | 672-ball FC-FBGA (27 x 27 mm, 1 mm pitch, FineLine BGA) |
| Process Technology | 0.15 micrometer all-layer copper (up to 8 metal layers) | — |
| Programming Interfaces | Passive Serial, Fast Passive Parallel, JTAG (IEEE 1149.1) | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Lifecycle | Last-Time-Buy / EOL announced Nov-Dec 2016 | — |
| Estado RoHS | Compliant (per Full-Electronic listing) | [DATA_NEEDED: RoHS compliance status] |
| Logic Family | — | APEX II (CMOS) |
| Series | — | Altera APEX II (EP2A) |
| Logic Elements / Cells | — | 16,640 |
| Equivalent Gates | — | 600,000 |
| Maximum User I/O Pins | — | 492 |
| Propagation Delay | — | 1.94 ns |
| Internal Operating Frequency (max) | — | 379 MHz |
| Technology Process | — | 0.15 µm all-layer copper CMOS, up to 8 metal layers |
| Core Supply Voltage | — | 1.5 V |
| Temperatura de funcionamiento | — | 0°C to +85°C (commercial grade) |
| Tipo de montaje | — | Surface Mount |
| Nivel MSL | — | 3 (per FC-FBGA moisture sensitivity, typical) |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: lead-free status] |
| I/O Speed Grade | — | Up to 1 Gbps (LVDS) |
| Special Blocks | — | CAM (Content-Addressable Memory), dedicated multipliers, PLLs |
| Speed Grade | — | C9 (fastest commercial grade in the APEX II speed-grade system) |