EP2A25B652C9 vs EP2A15B652C9 Vergleich
Detaillierter Direktvergleich von EP2A25B652C9 von Intel und EP2A15B652C9 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A25B652C9 | EP2A15B652C9 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $105,00 | $195,00 |
| Device Family | APEX II (EP2A25) | — |
| Logic Elements | 24,320 | 15,600 |
| Gehäuse | 652-ball FineLine BGA | 652-ball FineLine BGA |
| Speed Grade | C9 (-7 commercial) | -9 (fastest APEX II commercial) |
| Process Technology | 0.18 µm CMOS | — |
| Betriebstemperaturbereich | [DATA_NEEDED: commercial/industrial temperature range] | — |
| Core Voltage (VCCINT) | 1.8 V | — |
| I/O Voltage Standards | LVTTL, LVCMOS, SSTL, LVDS | 1.5 V, 1.8 V, 2.5 V, 3.3 V (LVTTL, LVCMOS, LVDS, SSTL, HSTL) |
| Configuration Interface | JTAG (IEEE 1149.1), passive serial, MAX configuration scheme | — |
| Embedded Memory | Embedded array blocks (EABs) | — |
| Embedded Multipliers | Yes (DSP blocks) | — |
| Maximum User I/O | [DATA_NEEDED: maximum usable I/O count for 652 BGA] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | Yes |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | 3 (168 hours) |
| Family | — | APEX II |
| Embedded System Blocks | — | 425 Kbits |
| Number of DLLs/PLLs | — | 4 PLUs |
| Core Voltage | — | 1.5 V |
| Betriebstemperatur | — | 0 C to +85 C (commercial) |
| Configuration Method | — | SRAM-based, JTAG 1149.1 boundary scan |
| Programming File Format | — | .pof / .sof (Quartus) |
| Lebenszyklusstatus | — | Obsolete - new design not recommended |