EP2A25F672C8N vs EP2A25F672C9N Vergleich

Detaillierter Direktvergleich von EP2A25F672C8N von Intel und EP2A25F672C9N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A25F672C8N EP2A25F672C9N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $205,00 $195,00
Family APEX II APEX II
Technology Node 0.15 um all-layer copper process —
System Gates 900,000 Approx. 900000
Logic Elements / Cells 24,320 24320
Maximum Internal Frequency 333 MHz —
Propagation Delay 1.69 ns 2.23 ns
User I/Os 492 —
Gehäuse 672-ball FC-FBGA (FineLine BGA) 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch
Package Body Size 27 x 27 mm —
Ball Pitch 1.0 mm —
Core Supply Voltage 1.5 V —
Speed Grade C8 —
Betriebstemperatur 0 C to 85 C (commercial) 0 °C to +85 °C (commercial, C9 grade)
Multi-Gigabit Transceiver Rate Up to 1 Gbps per channel —
Montageart Surface Mount Surface Mount (BGA)
RoHS-Status Compliant Compliant (per distributor listings)
Lead-Free Suffix N (lead-free, Pb-free finish) —
Maximum User I/O — 492
Operating Frequency — 236 MHz
Core Supply Voltage (VCCINT) — 1.425 V to 1.575 V (nominal 1.5 V)
Process Technology — 0.15 µm all-layer copper, up to 8 metal layers
Seated Height (max) — 2.100 mm
Logic Family — CMOS
I/O Standards Supported — LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport
LVDS Data Rate — Up to 1 Gbps (True-LVDS)
Configuration Interface — Serial / Parallel PROM, JTAG, passive parallel (enhanced)
Embedded Memory — Enhanced System Blocks (ESBs) for dual-port RAM
Design Software — Quartus II (v5.1 or later)

Datenblätter & Ressourcen

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