EP2A25F672C9ES vs EP2A25F672C8N Vergleich
Detaillierter Direktvergleich von EP2A25F672C9ES von Intel und EP2A25F672C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2A25F672C9ES - APEX II FPGA 900K Gates 236MHz | Intel
EP2A25F672C9ES ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2A25F672C9ES | EP2A25F672C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $122,00 | $205,00 |
| Family | APEX II | APEX II |
| Logic Elements | 24,320 | — |
| System Gates | 900,000 | 900,000 |
| Maximum Operating Frequency | 236 MHz | — |
| Propagation Delay | 1.69 ns | 1.69 ns |
| Process Technology | 0.15 µm CMOS (up to 8 metal layers, all-layer copper) | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| User I/Os | 492 | 492 |
| Gehäuse | 672-pin FC-FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch | 672-ball FC-FBGA (FineLine BGA) |
| Speed Grade | -9 | C8 |
| Configuration Class | ES (Enhanced) | — |
| Betriebstemperatur | 0 °C to 85 °C (Commercial) | 0 C to 85 C (commercial) |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| MSL-Level | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Logic Family | CMOS | — |
| Technology Node | — | 0.15 um all-layer copper process |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |