EP2A25F672C9ES vs EP2A25F672C8N Comparación
Comparación detallada lado a lado de EP2A25F672C9ES por Intel y EP2A25F672C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A25F672C9ES | EP2A25F672C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $122,00 | $205,00 |
| Family | APEX II | APEX II |
| Logic Elements | 24,320 | — |
| System Gates | 900,000 | 900,000 |
| Maximum Operating Frequency | 236 MHz | — |
| Propagation Delay | 1.69 ns | 1.69 ns |
| Process Technology | 0.15 µm CMOS (up to 8 metal layers, all-layer copper) | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| User I/Os | 492 | 492 |
| Encapsulado | 672-pin FC-FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch | 672-ball FC-FBGA (FineLine BGA) |
| Speed Grade | -9 | C8 |
| Configuration Class | ES (Enhanced) | — |
| Temperatura de funcionamiento | 0 °C to 85 °C (Commercial) | 0 C to 85 C (commercial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Nivel MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Logic Family | CMOS | — |
| Technology Node | — | 0.15 um all-layer copper process |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |