EP2A25F672I6 vs EP2A25F672C7 Vergleich

Detaillierter Direktvergleich von EP2A25F672I6 von Intel und EP2A25F672C7 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A25F672I6 EP2A25F672C7
Marke Intel Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $178,00 $118,00
Family APEX II —
Logic Elements (typical gates) 25,000 —
Fabric Architecture SRAM-based LUT —
Process Technology 0.18 µm CMOS 0.15-um all-layer copper, up to 8 metal layers
Gehäuse 672-ball FineLine BGA (FBGA-672) 672-ball FCBGA (FineLine BGA)
Core Voltage 1.5 V —
Configuration Method External SRAM configuration device (EPC series) —
Temperature Grade Industrial (-40 °C to +100 °C ambient) —
Speed Grade 6 -7
Embedded Memory Embedded System Blocks (ESB), dual-port RAM / CAM —
DSP Blocks MultiCore dedicated multipliers —
Boundary Scan JTAG (IEEE 1149.1) compliant —
Clock Management Dedicated PLL / clock tree circuitry —
I/O Bank Count [DATA_NEEDED: number of user I/O banks] —
RoHS-Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Lead-Free [DATA_NEEDED: lead-free status] —
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Montageart Surface Mount (BGA) —
Product Family — APEX II
Logic Elements — 25,000
Maximum System Gates — 1,650,000
Maximum RAM Bits — 422,976
User I/O Count — 492
Supply Voltage (Core) — 1.5 V
LVDS Data Rate — 1 Gbps per channel (True-LVDS)
I/O Standards Supported — LVDS, LVPECL, PCML, HyperTransport
Betriebstemperatur — 0C to +85C (Commercial)
Configuration Mode — Passive Serial, Passive Parallel, JTAG
Embedded System Blocks (ESB) — Yes - RAM, ROM, CAM, multiplier support

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