EP2A25F672I6 vs EP2A25F672C8 Vergleich

Detaillierter Direktvergleich von EP2A25F672I6 von Intel und EP2A25F672C8 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A25F672I6 EP2A25F672C8
Marke Intel Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $178,00 $951,18
Family APEX II APEX II (EP2A25)
Logic Elements (typical gates) 25,000 —
Fabric Architecture SRAM-based LUT —
Process Technology 0.18 µm CMOS 0.15 microm CMOS, 8-layer copper interconnect
Gehäuse 672-ball FineLine BGA (FBGA-672) 672-FBGA (FineLine BGA, 27x27 mm, 1.0 mm pitch)
Core Voltage 1.5 V —
Configuration Method External SRAM configuration device (EPC series) —
Temperature Grade Industrial (-40 °C to +100 °C ambient) —
Speed Grade 6 C8
Embedded Memory Embedded System Blocks (ESB), dual-port RAM / CAM ESB blocks (dual-port RAM, FIFO, CAM, ROM)
DSP Blocks MultiCore dedicated multipliers —
Boundary Scan JTAG (IEEE 1149.1) compliant —
Clock Management Dedicated PLL / clock tree circuitry —
I/O Bank Count [DATA_NEEDED: number of user I/O banks] —
RoHS-Status [DATA_NEEDED: RoHS compliance status] Non-compliant (legacy product)
Lead-Free [DATA_NEEDED: lead-free status] —
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Montageart Surface Mount (BGA) Surface Mount
Logic Elements — 25,000 (typical gates)
Maximum System Gates — 40,960
Macrocells / Embedded Logic — 2,432 macros
User I/O Count — 492
Propagation Delay (tpd) — 1.69 ns
Betriebstemperatur — 0 C to 85 C (commercial)
I/O Standards Supported — LVTTL, LVCMOS, PCI-X, GTL+, SSTL-2/3, HSTL, LVDS, LVPECL
LVDS Data Rate — 1 Gbps
PLL Count — 4
I/O Banks — 16

Datenblätter & Ressourcen

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