EP2A25F672I6 vs EP2A25F672I9 Vergleich

Detaillierter Direktvergleich von EP2A25F672I6 von Intel und EP2A25F672I9 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A25F672I6 EP2A25F672I9
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $178,00 $135,00
Family APEX II APEX II
Logic Elements (typical gates) 25,000 —
Fabric Architecture SRAM-based LUT —
Process Technology 0.18 µm CMOS 0.15 µm CMOS
Gehäuse 672-ball FineLine BGA (FBGA-672) 672-pin FC-FBGA
Core Voltage 1.5 V —
Configuration Method External SRAM configuration device (EPC series) —
Temperature Grade Industrial (-40 °C to +100 °C ambient) Industrial (-40 °C to +100 °C)
Speed Grade 6 9 (fastest APEX II grade)
Embedded Memory Embedded System Blocks (ESB), dual-port RAM / CAM —
DSP Blocks MultiCore dedicated multipliers —
Boundary Scan JTAG (IEEE 1149.1) compliant —
Clock Management Dedicated PLL / clock tree circuitry —
I/O Bank Count [DATA_NEEDED: number of user I/O banks] —
RoHS-Status [DATA_NEEDED: RoHS compliance status] Unknown (legacy 2000s part; verify lot certificate)
Lead-Free [DATA_NEEDED: lead-free status] —
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Montageart Surface Mount (BGA) Surface Mount (flip-chip BGA)
Manufacturer — Intel (formerly Altera)
Logic Elements (LEs) — 24,320
System Gates (typical) — 900,000
Maximum Operating Frequency — 236 MHz
Core Voltage (VCCINT) — 1.5 V
Pin-Anzahl — 672
Embedded System Blocks (ESBs) — Yes (dual-port RAM/ROM)
Maximum User I/O — [DATA_NEEDED: max user I/O pin count]
Maximum Memory Bits — 422,400 bits
PLLs — 4
Peak Reflow Temperature — 220 °C (per distributor listing)
Feuchtigkeitsempfindlichkeitsgrad (MSL) — 3

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