EP2A25F672I8N vs EP2A25F672I9 Vergleich
Detaillierter Direktvergleich von EP2A25F672I8N von Intel und EP2A25F672I9 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2A25F672I8N - APEX II FPGA 900K Gates 672-BGA | Intel / Altera
EP2A25F672I8N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2A25F672I8N | EP2A25F672I9 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $198,50 | $135,00 |
| Family | APEX II | APEX II |
| Device | EP2A25 | — |
| Logic Elements | 24,320 | — |
| Gates | 900,000 | — |
| Embedded Memory (bits) | 622,592 | — |
| User I/Os | 492 | — |
| Gehäuse | 672-ball FC-FBGA (FineLine BGA) | 672-pin FC-FBGA |
| Package Size | 27 x 27 mm | — |
| Ball Pitch | 1 mm | — |
| Process Technology | 0.15 µm all-layer copper-metal | 0.15 µm CMOS |
| Metal Layers | Up to 8 | — |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V |
| Internal Frequency (max) | 333 MHz | — |
| Propagation Delay | 1.69 ns | — |
| Betriebstemperatur | 0 °C to 85 °C | — |
| Logic Family | CMOS | — |
| I/O Standards Supported | True-LVDS, LVPECL, PCML, HyperTransport | — |
| Configuration Method | SRAM-based (Altera Quartus II) | — |
| RoHS-Status | unknown | Unknown (legacy 2000s part; verify lot certificate) |
| Lead-Free | unknown | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LEs) | — | 24,320 |
| System Gates (typical) | — | 900,000 |
| Maximum Operating Frequency | — | 236 MHz |
| Pin-Anzahl | — | 672 |
| Temperature Grade | — | Industrial (-40 °C to +100 °C) |
| Speed Grade | — | 9 (fastest APEX II grade) |
| Embedded System Blocks (ESBs) | — | Yes (dual-port RAM/ROM) |
| Maximum User I/O | — | [DATA_NEEDED: max user I/O pin count] |
| Maximum Memory Bits | — | 422,400 bits |
| PLLs | — | 4 |
| Montageart | — | Surface Mount (flip-chip BGA) |
| Peak Reflow Temperature | — | 220 °C (per distributor listing) |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | — | 3 |