EP2A40B652C9 vs EP2A25B652C9 Vergleich

Detaillierter Direktvergleich von EP2A40B652C9 von Intel und EP2A25B652C9 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A40B652C9 EP2A25B652C9
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $92,40 $105,00
Family APEX II —
Maximum System Gates 1.5 M (40K logic elements) —
Logic Elements 40,160 24,320
Embedded System Blocks Yes (dual-port RAM, ROM, CAM) —
Maximum User I/O Pins [DATA_NEEDED: user I/O count] —
Gehäuse 652-pin BGA 652-ball FineLine BGA
Process Technology 0.18 µm CMOS 0.18 µm CMOS
Core Voltage 1.5 V —
Supply Voltage (I/O) 3.3 V (multi-standard I/O supported) —
Betriebstemperatur -40C to +85C (industrial, C9 suffix) —
Configuration Method SRAM-based, serial/parallel, JTAG IEEE 1149.1 —
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL+, SSTL, LVDS —
PLL Count [DATA_NEEDED: PLL count] —
Montageart Surface Mount (BGA) Surface Mount (BGA)
MSL-Level 3 (168 hours floor life) [DATA_NEEDED: moisture sensitivity level]
RoHS-Status unknown [DATA_NEEDED: RoHS compliance status]
Device Family — APEX II (EP2A25)
Speed Grade — C9 (-7 commercial)
Betriebstemperaturbereich — [DATA_NEEDED: commercial/industrial temperature range]
Core Voltage (VCCINT) — 1.8 V
I/O Voltage Standards — LVTTL, LVCMOS, SSTL, LVDS
Configuration Interface — JTAG (IEEE 1149.1), passive serial, MAX configuration scheme
Embedded Memory — Embedded array blocks (EABs)
Embedded Multipliers — Yes (DSP blocks)
Maximum User I/O — [DATA_NEEDED: maximum usable I/O count for 652 BGA]
Lead-Free — [DATA_NEEDED: lead-free status]

Datenblätter & Ressourcen

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