EP2A40F672C7 vs EP2A40F672C6N Vergleich
Detaillierter Direktvergleich von EP2A40F672C7 von Intel und EP2A40F672C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A40F672C7 | EP2A40F672C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,00 | $165,00 |
| Family | APEX II | APEX II |
| Logic Elements | 38,400 | 40,000 |
| System Gates | 1,500,000 | — |
| Macro Cells | 2,560 | — |
| Maximum User I/O | 492 | — |
| Process Technology | 0.15 µm CMOS, all-layer copper, up to 8 metal layers | SRAM-based, 0.18 um (per family datasheet) |
| Core Voltage | 1.5 V | 1.5 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Pin-to-Pin Delay | 1.55 ns (C7 speed grade) | — |
| Maximum Internal Frequency | 562 MHz | — |
| High-Speed Interface | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport | — |
| PLLs | 4 | — |
| Gehäuse | 672-ball FC-FBGA (FineLine BGA) | 672-ball FineLine BGA |
| Package Dimensions | 27 x 27 mm, 1.0 mm pitch | — |
| Montageart | Surface Mount | Surface Mount |
| Operating Temperature Grade | Commercial (per 'C' suffix in speed grade) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | — |
| Maximum System Gates | — | 1,125,000 |
| Embedded RAM Bits | — | 442,368 |
| Embedded System Blocks (ESBs) | — | 160 |
| Maximum User I/O Pins | — | [DATA_NEEDED: maximum user I/O count] |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V |
| Betriebstemperatur | — | Commercial (0C to +85C) |
| Speed Grade | — | C6 (per part number suffix) |
| Configuration Methods | — | Passive Serial, Passive Parallel, JTAG |
| PLL Count | — | [DATA_NEEDED: PLL count] |