EP2A70F1508C9 vs EP2A70F1508C7N Vergleich

Detaillierter Direktvergleich von EP2A70F1508C9 von Intel und EP2A70F1508C7N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP2A70F1508C9 EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera

EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera

EP2A70F1508C9 ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP2A70F1508C9 EP2A70F1508C7N
Marke Intel Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.310,00 $0,00
Series APEX II APEX II
Family APEX II FPGA —
Manufacturer Intel (formerly Altera) —
Logic Elements / Cells 67,200 —
Total RAM Bits 1,146,880 —
Number of I/O 1,060 —
Number of Logic Array Blocks (LABs) [DATA_NEEDED: number of LABs] —
Number of PLLs 4 —
Number of Gates [DATA_NEEDED: typical gate count] —
Voltage - Supply (Core) 1.425 V to 1.575 V —
Montageart Surface Mount Surface mount
Gehäuse / Bauform 1508-BBGA, FCBGA —
Supplier Device Package 1508-FBGA (40 × 40 mm) —
Betriebstemperatur 0 °C to 85 °C 0°C to 85°C
Speed Grade C9 —
Process Technology 0.15 µm all-layer copper, up to 8 metal layers —
High-Speed I/O Standards True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport —
Configuration Modes Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel —
Embedded Multiplier Blocks Yes —
Embedded Memory Type Dual-port RAM (ESB) / ROM / FIFO —
RoHS-Status [DATA_NEEDED: RoHS status] unknown
MSL-Level [DATA_NEEDED: MSL level] —
Device Type — Field Programmable Gate Array (FPGA)
Technology — 0.15 µm CMOS
Core Voltage — 1.5 V
Logic Cells — 67,200 cells
Logic Array Blocks — 6,720 LABs
Total RAM — 1,146,880 bits
Programmable I/O — 1,060 I/O pins
Maximum Stated Frequency — 420 MHz
Gate Capacity — 3 million gates
Gehäuse — 1508-pin FC-FBGA
REACH Status — unknown
AEC-Q100 Qualification — unknown
Configuration Method — [DATA_NEEDED: configuration method]
Package Dimensions — [DATA_NEEDED: package dimensions]
Wärmewiderstand — [DATA_NEEDED: thermal resistance]
Versorgungsstrom — [DATA_NEEDED: supply current]

Datenblätter & Ressourcen

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