EP2A70F1508C9 vs EP2A70F1508C7N 비교
다음의 상세 나란히 비교: EP2A70F1508C9 제조: Intel 및 EP2A70F1508C7N 제조: Altera. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP2A70F1508C9 | EP2A70F1508C7N |
|---|---|---|
| 브랜드 | Intel | Altera |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 최종 구매 | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1,310.00 | $0.00 |
| Series | APEX II | APEX II |
| Family | APEX II FPGA | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements / Cells | 67,200 | — |
| Total RAM Bits | 1,146,880 | — |
| Number of I/O | 1,060 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: number of LABs] | — |
| Number of PLLs | 4 | — |
| Number of Gates | [DATA_NEEDED: typical gate count] | — |
| Voltage - Supply (Core) | 1.425 V to 1.575 V | — |
| 실장 유형 | Surface Mount | Surface mount |
| 패키지 / 케이스 | 1508-BBGA, FCBGA | — |
| Supplier Device Package | 1508-FBGA (40 × 40 mm) | — |
| 동작 온도 | 0 °C to 85 °C | 0°C to 85°C |
| Speed Grade | C9 | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| High-Speed I/O Standards | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport | — |
| Configuration Modes | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel | — |
| Embedded Multiplier Blocks | Yes | — |
| Embedded Memory Type | Dual-port RAM (ESB) / ROM / FIFO | — |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | unknown |
| MSL 레벨 | [DATA_NEEDED: MSL level] | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Technology | — | 0.15 µm CMOS |
| Core Voltage | — | 1.5 V |
| Logic Cells | — | 67,200 cells |
| Logic Array Blocks | — | 6,720 LABs |
| Total RAM | — | 1,146,880 bits |
| Programmable I/O | — | 1,060 I/O pins |
| Maximum Stated Frequency | — | 420 MHz |
| Gate Capacity | — | 3 million gates |
| 패키지 | — | 1508-pin FC-FBGA |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| 열 저항 | — | [DATA_NEEDED: thermal resistance] |
| 공급 전류 | — | [DATA_NEEDED: supply current] |