EP2AGX125EF29C5G vs EP2AGX190EF29C6G Vergleich
Detaillierter Direktvergleich von EP2AGX125EF29C5G von Intel und EP2AGX190EF29C6G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX125EF29C5G | EP2AGX190EF29C6G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.090,00 | $1.010,00 |
| Family | Arria II GX | Arria II |
| Series | Arria II GX | Arria II GX |
| Logic Elements (LE) | 118,143 | 190,000 |
| Adaptive Logic Modules (ALM) | 49,600 | 181,165 |
| Embedded Memory Bits | 8,315,904 | — |
| M9K Block RAM Blocks | 730 | — |
| MLAB Memory | 1,512 Kbits | — |
| 18x18 Multipliers | 590 | — |
| User I/Os | 372 | — |
| I/O Banks | 12 | — |
| Transceiver Channels | 8 | — |
| Transceiver Data Rate (max) | 3.75 Gbps | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | C5 (commercial) | -6 |
| Gehäuse | 780-FBGA (FCBGA, 29x29 mm, 1.0 mm pitch) | 780-ball FCBGA (Flip-Chip BGA) |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to 85C (commercial) |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Total RAM Bits | — | 10,177,536 (12,144 Kbit) |
| Maximum User I/O | — | 372 |
| Lead-Free | — | Yes |
| Halogenfrei | — | [DATA_NEEDED: halogen-free status] |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Process Node | — | 40 nm |
| Transceiver Count | — | [DATA_NEEDED: exact transceiver count] |
| Transceiver Data Rate | — | 600 Mbps to 6.375 Gbps |
| Versorgungsspannung | — | [DATA_NEEDED: VCCINT/VCCIO values] |