EP2AGX125EF29C5G vs EP2AGX190EF29C6G Comparación
Comparación detallada lado a lado de EP2AGX125EF29C5G por Intel y EP2AGX190EF29C6G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX125EF29C5G | EP2AGX190EF29C6G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.090,00 | $1.010,00 |
| Family | Arria II GX | Arria II |
| Series | Arria II GX | Arria II GX |
| Logic Elements (LE) | 118,143 | 190,000 |
| Adaptive Logic Modules (ALM) | 49,600 | 181,165 |
| Embedded Memory Bits | 8,315,904 | — |
| M9K Block RAM Blocks | 730 | — |
| MLAB Memory | 1,512 Kbits | — |
| 18x18 Multipliers | 590 | — |
| User I/Os | 372 | — |
| I/O Banks | 12 | — |
| Transceiver Channels | 8 | — |
| Transceiver Data Rate (max) | 3.75 Gbps | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | C5 (commercial) | -6 |
| Encapsulado | 780-FBGA (FCBGA, 29x29 mm, 1.0 mm pitch) | 780-ball FCBGA (Flip-Chip BGA) |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to 85C (commercial) |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Total RAM Bits | — | 10,177,536 (12,144 Kbit) |
| Maximum User I/O | — | 372 |
| Lead-Free | — | Yes |
| Sin halógenos | — | [DATA_NEEDED: halogen-free status] |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Process Node | — | 40 nm |
| Transceiver Count | — | [DATA_NEEDED: exact transceiver count] |
| Transceiver Data Rate | — | 600 Mbps to 6.375 Gbps |
| Tensión de alimentación | — | [DATA_NEEDED: VCCINT/VCCIO values] |