EP2AGX125EF29C5G vs EP2AGX190EF29C6G 对比
详细并排对比 EP2AGX125EF29C5G 出自 Intel 和 EP2AGX190EF29C6G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2AGX125EF29C5G | EP2AGX190EF29C6G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,090.00 | $1,010.00 |
| Family | Arria II GX | Arria II |
| Series | Arria II GX | Arria II GX |
| Logic Elements (LE) | 118,143 | 190,000 |
| Adaptive Logic Modules (ALM) | 49,600 | 181,165 |
| Embedded Memory Bits | 8,315,904 | — |
| M9K Block RAM Blocks | 730 | — |
| MLAB Memory | 1,512 Kbits | — |
| 18x18 Multipliers | 590 | — |
| User I/Os | 372 | — |
| I/O Banks | 12 | — |
| Transceiver Channels | 8 | — |
| Transceiver Data Rate (max) | 3.75 Gbps | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | C5 (commercial) | -6 |
| 封装 | 780-FBGA (FCBGA, 29x29 mm, 1.0 mm pitch) | 780-ball FCBGA (Flip-Chip BGA) |
| 工作温度 | 0C to +85C (commercial) | 0C to 85C (commercial) |
| RoHS 状态 | Compliant | Compliant |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Total RAM Bits | — | 10,177,536 (12,144 Kbit) |
| Maximum User I/O | — | 372 |
| Lead-Free | — | Yes |
| 无卤 | — | [DATA_NEEDED: halogen-free status] |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |
| Process Node | — | 40 nm |
| Transceiver Count | — | [DATA_NEEDED: exact transceiver count] |
| Transceiver Data Rate | — | 600 Mbps to 6.375 Gbps |
| 电源电压 | — | [DATA_NEEDED: VCCINT/VCCIO values] |