EP2AGX95DF25C6G vs EP2AGX125DF25I3G Vergleich
Detaillierter Direktvergleich von EP2AGX95DF25C6G von Intel und EP2AGX125DF25I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel
EP2AGX125DF25I3G ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2AGX95DF25C6G | EP2AGX125DF25I3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $290,00 | $895,00 |
| Family | Arria II GX | — |
| Logic Elements (LE) | 89,178 | — |
| Adaptive Logic Modules (ALM) | 35,600 (estimated) | — |
| Embedded Memory Bits | 6,839,296 bits | — |
| Embedded Memory Type | M9K + M144K blocks | — |
| DSP Blocks | Variable-precision (estimated 88 to 176) | 18x18 multipliers |
| User I/O | 260 | — |
| Transceivers | Up to 12 channels | Up to 12 (3.75 Gbps per channel) |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Hard Memory Controller | Yes (DDR3, DDR2, QDRII+) | — |
| PLL | Up to 8 (per family datasheet) | — |
| Process Node | 40 nm | — |
| Gehäuse | 572-ball FCBGA, 25x25 mm | 572-BGA, FCBGA (Flip-Chip FineLine BGA) |
| Speed Grade | -6 (fastest commercial) | — |
| Betriebstemperatur | 0C to 85C (commercial, junction) | -40C to +100C (Industrial) |
| Configuration Modes | AS, AP, FPP, PS, JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Series | — | Arria II GX |
| Logic Elements | — | 118,143 |
| Embedded Memory | — | 8,315,904 bits |
| Number of I/O | — | 260 |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 40 nm |
| Maximum Operating Frequency | — | 500 MHz |
| Montageart | — | Surface Mount |
| Versorgungsspannung | — | 0.9 V core |
| MSL-Level | — | [DATA_NEEDED: MSL Level] |