EP2AGX95DF25C6G vs EP2AGX125DF25I3G Comparación
Comparación detallada lado a lado de EP2AGX95DF25C6G por Intel y EP2AGX125DF25I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel
EP2AGX125DF25I3G ⚠ Última compraComparación de especificaciones
| Parámetro | EP2AGX95DF25C6G | EP2AGX125DF25I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $290,00 | $895,00 |
| Family | Arria II GX | — |
| Logic Elements (LE) | 89,178 | — |
| Adaptive Logic Modules (ALM) | 35,600 (estimated) | — |
| Embedded Memory Bits | 6,839,296 bits | — |
| Embedded Memory Type | M9K + M144K blocks | — |
| DSP Blocks | Variable-precision (estimated 88 to 176) | 18x18 multipliers |
| User I/O | 260 | — |
| Transceivers | Up to 12 channels | Up to 12 (3.75 Gbps per channel) |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Hard Memory Controller | Yes (DDR3, DDR2, QDRII+) | — |
| PLL | Up to 8 (per family datasheet) | — |
| Process Node | 40 nm | — |
| Encapsulado | 572-ball FCBGA, 25x25 mm | 572-BGA, FCBGA (Flip-Chip FineLine BGA) |
| Speed Grade | -6 (fastest commercial) | — |
| Temperatura de funcionamiento | 0C to 85C (commercial, junction) | -40C to +100C (Industrial) |
| Configuration Modes | AS, AP, FPP, PS, JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Series | — | Arria II GX |
| Logic Elements | — | 118,143 |
| Embedded Memory | — | 8,315,904 bits |
| Number of I/O | — | 260 |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 40 nm |
| Maximum Operating Frequency | — | 500 MHz |
| Tipo de montaje | — | Surface Mount |
| Tensión de alimentación | — | 0.9 V core |
| Nivel MSL | — | [DATA_NEEDED: MSL Level] |