EP2AGX95DF25C6N vs EP2AGX95DF25I3G Vergleich
Detaillierter Direktvergleich von EP2AGX95DF25C6N von Intel und EP2AGX95DF25I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX95DF25C6N | EP2AGX95DF25I3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.750,00 | $1.020,00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 89,178 | — |
| Logic Array Blocks (LAB) | 3,747 | — |
| Embedded Memory Bits | 6,839,296 | 6,839,296 |
| Maximum User I/Os | 260 | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Gehäuse | 572-ball FCBGA (Flip-Chip BGA) | 572-ball FCBGA |
| Maximum Operating Frequency | 400 MHz | — |
| Transceiver Data Rate | up to 3.125 Gbps | — |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 6 | I3 |
| RoHS-Status | Compliant | Compliant |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | Serial/Parallel via Altera Quartus II |
| Montageart | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Logic Elements | — | 89,178 |
| User I/O Count | — | 260 |
| Temperature Grade | — | Industrial |
| Betriebstemperatur | — | -40C to +100C |
| Lead-Free | — | Yes |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count per speed grade] |
| Maximum User I/O Voltage | — | [DATA_NEEDED: I/O bank supply range] |