EP2AGX95DF25C6N vs EP2AGX95DF25I3G Comparación
Comparación detallada lado a lado de EP2AGX95DF25C6N por Intel y EP2AGX95DF25I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX95DF25C6N | EP2AGX95DF25I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.750,00 | $1.020,00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 89,178 | — |
| Logic Array Blocks (LAB) | 3,747 | — |
| Embedded Memory Bits | 6,839,296 | 6,839,296 |
| Maximum User I/Os | 260 | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Encapsulado | 572-ball FCBGA (Flip-Chip BGA) | 572-ball FCBGA |
| Maximum Operating Frequency | 400 MHz | — |
| Transceiver Data Rate | up to 3.125 Gbps | — |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 6 | I3 |
| Estado RoHS | Compliant | Compliant |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | Serial/Parallel via Altera Quartus II |
| Tipo de montaje | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Logic Elements | — | 89,178 |
| User I/O Count | — | 260 |
| Temperature Grade | — | Industrial |
| Temperatura de funcionamiento | — | -40C to +100C |
| Lead-Free | — | Yes |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count per speed grade] |
| Maximum User I/O Voltage | — | [DATA_NEEDED: I/O bank supply range] |